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Home > Products > Ultrasonic for semiconductor > Copper Wire Ultrasonic Bonding Machine

Copper Wire Ultrasonic Bonding Machine
Application

IGBT, Automobile electrics, Laser facilities, Car-mounted charging stations

Features

Double drive control mode.

Marble platform.

Online welding quality monitoring.

In-line transport pulltester (ALC).

Magnetic spring compensation technology.

New GBS reduces consumable replacement time.

Technical Parameter
X, Y Axes
Linear motors, 0.1μm Resolution
Bond Area
300㎜*300㎜
Z-Axis
0.1 Resolution
Z-Stroke
50㎜
R-Axis
Direct Drive, ±220°, 0.096° Resolution
Repeatability
±3μm at 3σ
Wire Range
200-500μm Diameter
Bond Head
Front cutting or back cutting
Bond Pressure
Programmable, 500-5000g
Accuracy
<2000g, ±5g. >2000g, ±3%
Dimensions
800㎜(W)*1600㎜(D)*1850㎜(H)
Weight
1200kg
Samples
Stock Name:

驕成超聲

Stock Code:

688392



Sales hotline:400-888-0829
After-sales hotline:400-888-3348
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