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> Semikron Danfoss Delegation Visited SBT Ultrasonic for Semiconductor Ultrasonic Solution
On January 29, 2024, a delegation of seven from the global vice president of Semikron Danfoss visited SBT for a tour and inspection. The company was warmly received by General Manager Zhou Hongjian, Deputy General Managers Duan Zhongfu and Shi Xinhua, who is also in charge of R&D. Both parties engaged in an in-depth discussion on semiconductor ultrasonic welding and testing solutions.
Semikron Danfoss is a global technology leader in the power electronics field and has been deeply involved in semiconductor power module packaging, technological innovation, and customer products for over 90 years. Their products include semiconductor devices, power modules, modules, and systems.
During the visit, Semikron Danfoss focused on the cutting-edge technologies of ultrasonics in the semiconductor sector. SBT provided a detailed introduction to their independently developed semiconductor equipment, including ultrasonic bonders for terminals and pins, ultrasonic copper and aluminum wire bonders, and ultrasonic scanning microscopes (C-SAM/SAT). They also invited the clients to visit the production workshop for live demonstrations and tests.
The Semikron Danfoss delegation highly praised SBT's technical strength in the field of ultrasonics and expressed recognition and anticipation for SBT's ultrasonic semiconductor equipment.
In response to European clients' concerns about overseas business expansion, SBT stated during the meeting that they are preparing to establish a German subsidiary. In the future, this subsidiary will serve as a gateway to enhance market development, technological R&D, and after-sales services in Europe, providing more high-quality and comprehensive services to overseas customers.
SBT continues to increase its R&D investment in the semiconductor sector, actively introducing professional teams from the semiconductor industry. Relying on their ultrasonic technology platform, they have launched a series of semiconductor equipment, including ultrasonic bonders for terminals and pins, ultrasonic copper and aluminum wire bonders, and ultrasonic scanning microscopes (C-SAM/SAT), and have established cooperation with leading semiconductor clients in the industry. Furthermore, SBT is actively planning advanced semiconductor packaging product lines, leveraging their company strengths, intensifying R&D efforts, and contributing to the development of China's semiconductor industry.
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